? 1/9 table 1: main product characteristics i f(av) 2 a v rrm 600 v t j 175c v f (typ) 1 v t rr (typ) 35 ns STTH2R06 high efficiency ultrafast diode table 3: absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 600 v i f(rms) rms forward voltage 7 a i f(av) average forward current = 0.5 do-41 t l = 70c 2a sma t l = 85c smb t l = 100c smc t l = 115c i fsm surge non repetitive forward current do-41 t p = 10ms sinusoidal 40 a sma / smb / smc 30 t stg storage temperature range -65 to + 175 c t j operating junction temperature range -40 to + 175 c sma STTH2R06a smc STTH2R06s do-41 STTH2R06 k a smb STTH2R06u june 2005 rev. 2 features and benefits very low conduction losses negligible switching losses low forward and reverse recovery times high junction temperature description the STTH2R06 is using st turbo 2 600v planar pt doping technology. it is specially suited for switching mode base drive & transistor circuits. packaged in axial, sma, smb and smc, this de- vice is intended for use in high frequency inverters, free wheeling and polarity protection. table 2: order codes part number marking STTH2R06 STTH2R06 STTH2R06rl STTH2R06 STTH2R06a r6a STTH2R06u r6u STTH2R06s r62
STTH2R06 2/9 table 4: thermal resistance table 5: static electrical characteristics pulse test: * tp = 5 ms, < 2% ** tp = 380 s, < 2% to evaluate the conduction losses use the following equation: p = 1 x i f(av) + 0.125 i f 2 (rms) table 6: dynamic characteristics symbol parameter value (max). unit r th(j-l) junction to lead do-41 l = 5 mm 35 c/w sma 30 smb 25 smc 20 symbol parameter test conditions min. typ max. unit i r * reverse leakage current t j = 25c v r = v rrm 2 a t j = 150c 12 85 v f ** forward voltage drop t j = 25c i f = 2a 1.7 v t j = 150c 1.0 1.25 symbol parameter test conditions min. typ max. unit t rr reverse recovery time t j = 25c i f = 0.5a irr = 0.25a i r =1a 30 ns i f = 1a di f /dt = -50 a/s v r =30v 35 50 t fr forward recovery time t j = 25c i f = 2a di f /dt = 100 a/s v fr = 1.1 x v fmax 100 ns v fp forward recovery voltage 10 v
STTH2R06 3/9 figure 1: conduction losses versus average forward current figure 2: forward voltage drop versus forward current figure 3: relative variation of thermal impedance junction to case versus pulse duration (sma/smb/smc: s cu = 1cm 2 ) figure 4: peak reverse recovery current versus di f /dt (typical values) figure 5: reverse recovery time versus di f /dt (typical values) figure 6: reverse recovery charges versus di f /dt (typical values) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.5 1.0 1.5 2.0 2.5 p(w) i (a) f(av) t =tp/t tp = 0.05 = 0.1 = 0.2 = 1 = 0.5 0 1 2 3 4 5 6 7 8 9 10 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 i (a) fm v (v) fm t =150c (typical values) j t =25c (maximum values) j t =150c (maximum values) j 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-a) th(j-a) single pulse t (s) p sma do-41 smc smb 0 1 2 3 4 5 6 7 8 9 0 50 100 150 200 250 300 350 400 450 500 i (a) rm di /dt(a/s) f i =2 x i ff(av) i=i f f(av) i =0.5 x i f f(av) v =400v t =125c r j 0 50 100 150 200 250 300 0 50 100 150 200 250 300 350 400 450 500 t (ns) rr di /dt(a/s) f i =2 x i f f(av) i=i f f(av) i =0.5 x i f f(av) v =400v t =125c r j 0 50 100 150 200 250 300 350 400 0 100 200 300 400 500 q (nc) rr i =2 x i ff(av) i =0.5 x i f f(av) di /dt(a/s) f i=i ff(av) v =400v t =125c r j
STTH2R06 4/9 figure 7: relative variations of dynamic parameters versus junction temperature figure 8: transient peak forward voltage versus di f /dt (typical values) figure 9: forward recovery time versus di f /dt (typical values) figure 10: junction capacitance versus reverse voltage applied (typical values) figure 11: thermal resistance junction to ambient versus copper surface under each lead (epoxy fr4, e cu =35m) (sma/smb/smc) figure 12: thermal resistance versus lead length (do-41) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 25 50 75 100 125 i rm q rr t rr t (c) j i=i reference: t =125c f f(av) j v =400v r 0 5 10 15 20 25 30 0 50 100 150 200 250 v (v) fp di /dt(a/s) f i=i t =125c f f(av) j 0 50 100 150 200 250 300 0 50 100 150 200 250 t (ns) fr di /dt(a/s) f i=i t =125c f f(av) j v =1.1 x v max. fr f 1 10 100 1 10 100 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j r (c/w) th(j-a) 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 sma smb smb s (cm2) cu 0 20 40 60 80 100 120 5 10152025 r (c/w) th l (mm) lead r th(j-a) r th(j-l)
STTH2R06 5/9 figure 13: sma package mechanical data figure 14: sma foot print dimensions (in millimeters) e c l e1 d a1 a2 b 1.50 6.10 2.30 1.75 2.30 ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.03 0.075 0.080 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 e 4.80 5.60 0.189 0.220 e1 3.95 4.60 0.156 0.181 d 2.25 2.95 0.089 0.116 l 0.75 1.60 0.030 0.063
STTH2R06 6/9 figure 15: smb package mechanical data figure 16: smb foot print dimensions (in millimeters) e c l e1 d a1 a2 b 1.64 6.10 2.23 2.30 2.23 ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 d 3.30 3.95 0.130 0.156 l 0.75 1.60 0.030 0.063
STTH2R06 7/9 figure 17: smc package mechanical data figure 18: smc foot print dimensions (in millimeters) e c l e2 e1 d a1 a2 b 4.25 8.65 2.20 3.30 2.20 ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 d 5.55 6.25 0.218 0.246 l 0.75 1.60 0.030 0.063
STTH2R06 8/9 figure 19: do-41 package mechanical data ca b o / o / d o / d c table 7: ordering information part number marking package weight base qty delivery mode STTH2R06 STTH2R06 do-41 0.34 g 2000 ammopack STTH2R06rl STTH2R06 do-41 0.34 g 5000 tape & reel STTH2R06a r6a sma 0.068 g 5000 tape & reel STTH2R06u r6u smb 0.11 g 2500 tape & reel STTH2R06s r62 smc 0.243 g 2500 tape & reel ref. dimensions millimeters inches min. max. min. max. a 4.07 5.20 0.160 0.205 b 2.04 2.71 0.080 0.107 c28 1.102 d 0.712 0.863 0.028 0.034 table 8: revision history date revision description of changes 07-sep-2004 1 first issue. 1-jun-2005 2 smc package addition.
STTH2R06 9/9 information furnished is believed to be accurate and reliable. however, stmicroelectronics assu mes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replac es all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devices or systems without express written approval of stmicroelectro nics. the st logo is a registered tr ademark of stmicroelectronics. all other names are the property of their respective owners ? 2005 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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